Drilling

Drilling process

In view of the ultra-small feature size of Z-direction interconnection in advanced packaging, Han's CNC provides a new set of laser processing solutions, which can meet the requirements for laser modification of glass substrate TGV, as well asmicro-holes drilling in redistribution layer (RDL) PSPI and flip chip (FC) substrate ABF film, and has been recognized by leading domestic and foreign packaging substrate enterprises.

Product	Name	Scope of application
	Ultra-fast Laser Drilling Machine DRD 30&50 Series	High-density interconnection, blind via processing of BT material substrate with ultra-low line width and line spacing.
	Ultra-fast Laser Drilling Machine DRD 10&30 Series	High-density interconnection, blind via processing of ABF material substrate with ultra-low line width and line spacing.
	Ultra-fast Laser Drilling Machine DRD10&30 Series	Solder Mask Opening
	Glass Laser Drilling Machine GLM550 Series	Modified Drilling and Cutting of Glass Substrates
	PCB Mechanical Drilling Machine HANS-F6MV	Single PIN and a large number of holes, requires high stability mechanical drilling