Driven by advanced DSP chip processes, the 800G+ optical modules are evolving toward a more refined and complex technical architecture, as PCBs transition from Anylayer HDI to Substrate-Like PCBs (SLP) with higher layer counts, ultra-thin copper foils and dielectric layers. Han's CNC provides a customized solution for high-precision alignment, strict temperature and pressure control, advanced material matching, and complex structural processes for multiple lamination of thinner materials