Advanced Packaging Solutions
As the core component of semiconductor packaging, IC packaging substrates are undergoing multiple transformations, including material iteration, process upgrading and expansion of application scenarios.
The new complete set of laser solutions we developed for the advanced packaging industry can be used for the processing of advanced packaging such as FC-CSP, FC-BGA, glass substrate, EMIB and FOPLP.The downstream application scenarios mainly include CPU, GPU, FPGA and ASIC for smartphones SoC, AiP, and AI computing power servers.
Core Technology&Main Products
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01
Drilling
01MoreDrilling
In view of the ultra-small feature size of Z-direction interconnection in advanced packaging, Han's CNC provides a new set of laser processing solutions, which can meet the requirements for laser modification of glass substrate TGV, as well asmicro-holes drilling in redistribution layer (RDL) PSPI and flip chip (FC) substrate ABF film, and has been recognized by leading domestic and foreign packaging substrate enterprises.
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02
Trimming
02MoreTrimming
The ABF film is used as the build-up material in the FC-BGA substrate and RDL processes. There is overflow after hot pressing, which affects the subsequent process and product quality. Han's CNC adopts a new process that enables the rapid removal of residual adhesive.
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03
Routing
03MoreRouting
With increasing chip signal transmission rate, embedded design shortens signal transmission paths for superior performance.To meet high-precision Cavity processing requirements, Han's CNC offers laser processing solutions that achieve ultra-high-precision routing and depth control.
In addition, for advanced packaging glass-based products, our ultrafast laser cold processing features minimal edge chipping and thermal impact, greatly improving the yield and quality reliability.
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04
Quality Control
04MoreQuality Control
Advanced packaging products feature high I/O interfaces and ultra-high pad densities. The FC-CSP product are delivered in strip form, while FC-BGA final products are supplied in single-unit.Han's CNC provides various testing machine solutions for different structural characteristics.The minimum positioning accuracy reaches ±2.5 μm and supports 4-wire testing with micro-probes of 25 μm.
They are all partnering with us.
We serve leading PCB enterprises worldwide, covering the top 100 PCB manufacturers in China, and gaining customer recognition with technology and quality.
Ranking is not in any particular order
