Case Title

Pain Point

As the mother of electronic products, PCB is the central nervous system of all electronic systems, supporting the rapid development of the electronic information industry and becoming an increasingly important carrier of technological progress in various industries. In the long run, the AI computing power industry chain gradually penetrates from training needs to inference needs, further increasing the demand for computing infrastructure such as 800G switches, GPGPU servers, ASIC servers, etc. AI PCBs have become the biggest growth point for industry development, including high multi-layer boards, high multi-layer HDI boards, large-sized advanced packaging carrier boards, class carrier boards, and other production capacity demands, promoting the continuous expansion of the specialized processing equipment market.

Overall, benefiting from the continuous development of electronic terminals and supply chain adjustments, the PCB specialized equipment market will maintain a high level of growth domestically while also experiencing growth overseas. The global diversification of the PCB industry will drive the overall expansion of the specialized equipment market.

Pressing is a key step in the manufacturing of PCB multilayer boards, which requires stacking the inner layer, semi cured sheet, and copper foil together. Through programmed heating and cooling, the semi cured sheet material is transformed from a semi cured state to a cured state, thereby forming a complete multilayer board. Conventional multi-layer boards require one-time lamination, while HDI requires multiple lamination based on its laminated structure. The company's vacuum lamination system has higher temperature uniformity and lamination flatness, which can meet the continuous improvement of interlayer uniformity requirements for multi-layer boards and HDI lamination.

Solution

As the mother of electronic products, PCB is the central nervous system of all electronic systems, supporting the rapid development of the electronic information industry and becoming an increasingly important carrier of technological progress in various industries. In the long run, the AI computing power industry chain gradually penetrates from training needs to inference needs, further increasing the demand for computing infrastructure such as 800G switches, GPGPU servers, ASIC servers, etc. AI PCBs have become the biggest growth point for industry development, including high multi-layer boards, high multi-layer HDI boards, large-sized advanced packaging carrier boards, class carrier boards, and other production capacity demands, promoting the continuous expansion of the specialized processing equipment market.

Overall, benefiting from the continuous development of electronic terminals and supply chain adjustments, the PCB specialized equipment market will maintain a high level of growth domestically while also experiencing growth overseas. The global diversification of the PCB industry will drive the overall expansion of the specialized equipment market.

Pressing is a key step in the manufacturing of PCB multilayer boards, which requires stacking the inner layer, semi cured sheet, and copper foil together. Through programmed heating and cooling, the semi cured sheet material is transformed from a semi cured state to a cured state, thereby forming a complete multilayer board. Conventional multi-layer boards require one-time lamination, while HDI requires multiple lamination based on its laminated structure. The company's vacuum lamination system has higher temperature uniformity and lamination flatness, which can meet the continuous improvement of interlayer uniformity requirements for multi-layer boards and HDI lamination.

The PCB production involves multiple inspection processes, with the most important being the integrity, appearance, and electrical performance testing of semi-finished and finished products to ensure the functionality and reliability of electronic products. With the increase of line density, the difficulty of detection also increases, and it is necessary to use automated detection equipment for detection. The company provides specialized testing equipment, general testing equipment, specialized high-precision testing equipment, high-voltage testing equipment, inductance testing equipment, and other products for different PCB testing needs, such as testing points, testing density, pad size, chip pitch, batch size, and four wire requirements in electrical performance testing; For the integrity and final appearance inspection of etched graphics, automatic optical inspection equipment (AOI and AVI) with different resolutions are provided based on different feature parameters to meet the quality inspection requirements of various types of PCB processing and finished products.

Value

Product collaboration can provide customers with a one-stop solution for the supply of multi category equipment and process solutions, significantly reducing the procurement and maintenance costs of client equipment and meeting their multi process needs; And by delving into customer production lines and continuing technical cooperation with customers, we continuously deepen our understanding of the upstream and downstream equipment and material technologies associated with existing products, accumulate key technologies for the company to expand its product line in the future, and further enrich the connotation of one-stop solutions. Process collaboration is the foundation for creating a digital and intelligent whole plant solution. The company lays out key equipment in key processes, and through unified process formula scheduling, relies on the big family data system for global linkage of the whole plant. The processing information of products in the front and back processes can be quickly exchanged, and super correction can be achieved between processes, thereby greatly improving the overall yield of the production line.